PUBLICATIONS

C. Luk, J. Buan, T. Ohshida, P.J. Wang, Y. Oryu, C.C. Huang and N. Jarvis, “Hacking skew measurement,” DesignCon 2018, 01/30 – 02/01/2018, Santa Clara, CA.

H. Barnes, E. Bogatin, J. Moreira, J. Ellison, J. Nadolny, C.C. Huang, M. Tsiklauri, S.J. Moon and V. Herrmann, “A NIST traceable PCB kit for evaluating the accuracy of de-embedding algorithms and corresponding metrics,” DesignCon 2018, 01/30 – 02/01/2018, Santa Clara, CA. (Best Paper)

J. Moreira, C.C. Huang and D. Lee, “DUT ATE test fixture S-parameters estimation using 1x-reflect methodology,” BiTS China Workshop, 09/07/2017, Shanghai, China.

J. Balachandran, K. Cai, Y. Sun, R. Shi, G. Zhang, C.C. Huang and B. Sen, “Aristotle: A fully automated SI platform for PCB material characterization,” DesignCon 2017, 01/31-02/02/2017, Santa Clara, CA.

C.C. Huang, “In-Situ De-embedding,” EDI CON, Beijing, China, 04/19 to 04/21/2016.

C. Luk, J. Buan, A. Nagao, T. Takada and C.C. Huang, “Tradeoffs between tightly and loosely coupled differential vias for multi-Gbps design,” DesignCon 2016, 01/19-01/22/2016, Santa Clara, CA.

K. Aihara, J. Buan, A. Nagao, T. Takada and C.C. Huang, “A novel method to reduce differential crosstalk in a high-speed channel,” DesignCon 2015, 01/27-01/30/2015, Santa Clara, CA.

K. Aihara, J. Buan, A. Nagao, T. Takada and C.C. Huang, “Minimizing differential crosstalk of vias for high-speed data transmission,” EPEPS 2014, 10/26-10/29/2014, Portland, OR.

A. Nagao, T. Takada, C.C. Huang, J. Buan, K. Aihara, P. Li and A. Mihara, “New methodologies for 25+ Gbps connector characterization,” DesignCon 2014, 01/28-01/31/2014, Santa Clara, CA.

J. Buan, T. Takada, F. Cheng, J. Weng, C. Luk, T. Arai, C.C. Huang, D. Yanagawa, P. Li, Y. Yang, “Embedded DC blocking capacitors in connectors – study of impacts on PCB design and high speed serial link performance,” DesignCon 2012, 01/30-02/02/2012, Santa Clara, CA.

Press

“Software tool fixes some causality violations” by Eric Bogatin, EDN, 02/17/2015.

“EDA startup takes on signal integrity barrier” by Max Maxfield, EE Times, 01/26/2015.

Presentations

“In-Situ De-embedding” Free seminar at DesignCon 2022, Sponsored by Rohde & Schwarz.

“In-Situ De-embedding” Webinar, Sponsored by Rohde & Schwarz and hosted by Signal Integrity Journal

“Material Property Extraction (MPX)”

“SI analysis & measurements as easy as mobile apps”

Patent

“Fixture de-embedding using calibration structures with open and short terminations,” Patent No. US9797977B2, Oct. 24, 2017.

“Fixture de-embedding using calibration structures with open and short terminations,” Patent No. US10761175B2, Sep. 1, 2020.

Video

Create a probe model by In-Situ De-embedding (ISD)