02/01/2024:
Paper: “Tackling massive number of power ports in a mixed-reference design,” 02/01/2024, 12:15 pm – 1:00 pm, Ballroom C, Santa Clara Convention Center, Santa Clara, CA.
02/01/2023:
04/06/2022:
08/17/2021:
01/29/2020 to 01/30/2020:
Visit our booth (No. 754) at DesignCon, Santa Clara Convention Center, Santa Clara, CA.
Tutorial: "Introduction to the IEEE P370 Standard & Its Applications for High Speed Interconnect Characterization," 01/28/2020, 1:30 pm - 4:30 pm, Ballroom B.
01/30/2019 to 01/31/2019:
Visit our booth (No. 1245) at DesignCon, Santa Clara Convention Center, Santa Clara, CA.
Paper: “S-parameter measurement & fixture de-embedding variation across multiple teams, equipment & de-embedding tools,” 01/30/2019, 11:00 am – 11:45 pm.
01/31/2018 to 02/01/2018:
Visit our booth (No. 600) at DesignCon, Santa Clara Convention Center, Santa Clara, CA.
Free seminar: “In-Situ De-embedding,” 01/31/2018, 9:20 am – 10:00 am, Great America Meeting Room 2, Sponsored by Rohde & Schwarz.
Paper: “Hacking skew measurement,” 01/31/2018, 2:50 pm – 3:30 pm.
Paper: “A NIST traceable PCB kit for evaluating the accuracy of de-embedding algorithms and corresponding metrics,” 02/01/2018, 11:00 am – 11:45 am.
12/12/2017:
Webinar: “In-Situ De-embedding” sponsored by Rohde & Schwarz and hosted by Signal Integrity Journal.
02/01/2017 to 02/02/2017:
Visit our booth (No. 855) at DesignCon, Santa Clara Convention Center, Santa Clara, CA.
Tutorial: “The Secret Life of Connectors: From SI and mechanical co-design to lab verification to mass production,” 01/31/2017, 9:00 am – 11:50 am.
R&S Sponsored Session (Free): “Material Property Extractor (MPX),” 02/01/2017, 11:05 am – 11:45 am.
Paper: “Aristotle: A fully automated SI platform for PCB material characterization,” 02/02/2017, 11:00 am – 11:45 am.